LTCC technology is especially beneficial for RF and high-frequency applications. In RF and wireless applications, LTCC also features the ability to embed passive elements, such as resistors, capacitors and inductors into the ceramic package minimizing the size of the completed module with extreme operating environment performance and miniature in footprint.

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LTCC hybrids is an attractive alternative to ASICs for small scale integration devices.  Our manufacturing process is highly automated to enhance the product reliability and stability.